The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2014

Filed:

Jun. 22, 2011
Applicants:

Yan Cui, Greer, SC (US);

Srikanth Chandrudu Kottilingam, Simpsonville, SC (US);

Daniel James Dorriety, Travelers Rest, SC (US);

Brian Lee Tollison, Honea Path, SC (US);

Dechao Lin, Greer, SC (US);

Hai Buu Sam, Simpsonville, SC (US);

Inventors:

Yan Cui, Greer, SC (US);

Srikanth Chandrudu Kottilingam, Simpsonville, SC (US);

Daniel James Dorriety, Travelers Rest, SC (US);

Brian Lee Tollison, Honea Path, SC (US);

Dechao Lin, Greer, SC (US);

Hai Buu Sam, Simpsonville, SC (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 9/04 (2006.01); B23K 9/235 (2006.01); B23K 10/02 (2006.01); B23K 26/34 (2014.01); B23K 26/30 (2014.01); B23K 26/32 (2014.01); B23K 35/30 (2006.01); C22C 19/05 (2006.01);
U.S. Cl.
CPC ...
B23K 9/044 (2013.01); B23K 9/235 (2013.01); B23K 10/027 (2013.01); B23K 26/345 (2013.01); B23K 26/421 (2013.01); B23K 26/3206 (2013.01); B23K 26/3213 (2013.01); B23K 35/3033 (2013.01); C22C 19/056 (2013.01); C22C 19/057 (2013.01); B23K 2201/001 (2013.01);
Abstract

A method of fabricating a component and a fabricated component are disclosed. The method includes depositing a material to a component and manipulating the material to form a boundary region and a filler region for desired properties. The component includes the boundary region and the filler region, thereby having the desired properties.


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