The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Jul. 07, 2011
Applicant:
Hisashi Ishida, Tokyo, JP;
Inventor:
Hisashi Ishida, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 9/00 (2013.01); H05K 1/0236 (2013.01); H05K 2201/0715 (2013.01);
Abstract
Leakage of electromagnetic noise from a wiring substrate is suppressed. A wiring substrate () includes a multilayered wiring layer, a structure () of a conductor, and an electromagnetic wave absorber (). An electronic component () which is an example of an electromagnetic noise generation source is mounted on the wiring substrate (). The electronic component () has a high-frequency circuit. The structure () is formed using the multilayered wiring layer, and is arranged so as to enclose the electronic component () in plan view with an opening () in the enclosure. The electromagnetic wave absorber () is arranged so as to cover the opening ().