The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2014

Filed:

Sep. 22, 2011
Applicants:

Daisuke Sakurai, Osaka, JP;

Kazuya Usirokawa, Osaka, JP;

Inventors:

Daisuke Sakurai, Osaka, JP;

Kazuya Usirokawa, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 7/06 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); H01L 21/48 (2006.01); H01L 23/544 (2006.01); H05K 1/02 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H05K 7/06 (2013.01); H01L 21/563 (2013.01); H01L 23/49838 (2013.01); H01L 24/05 (2013.01); H01L 24/14 (2013.01); H01L 23/36 (2013.01); H01L 21/4853 (2013.01); H01L 23/544 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H05K 1/02 (2013.01); H01L 23/3677 (2013.01); H01L 24/17 (2013.01); H01L 24/02 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 2224/023 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14136 (2013.01); H01L 2224/14179 (2013.01); H01L 2224/14515 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81007 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/831 (2013.01); H01L 2924/014 (2013.01); H01L 2224/13084 (2013.01); H01L 2224/8113 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/11442 (2013.01); H01L 2224/11464 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/136 (2013.01); H01L 2224/81132 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81411 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/1182 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/3512 (2013.01); H01L 2924/35121 (2013.01); H01L 2924/381 (2013.01); H01L 2924/3841 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17051 (2013.01); H01L 2224/16225 (2013.01);
Abstract

An electronic-component mounted body of the present invention includes an electronic component mounted on a circuit board. The electronic component includes multiple component-side electrode terminals, and the circuit board includes multiple circuit-board side electrode terminals for the component-side electrode terminals. The electronic-component mounted body further includes: multiple protruded electrodes formed respectively on the component-side electrode terminals of the electronic component to electrically connect the electronic component and the circuit board; and a dummy electrode formed on the electronic component and electrically connected to the component-side electrode terminal in a predetermined position out of the component-side electrode terminals. The protruded electrode on the component-side electrode terminal in the predetermined position is higher than the protruded electrode on the component-side electrode terminal in a different position from the predetermined position.


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