The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2014

Filed:

Apr. 14, 2011
Applicants:

Shusuke Yoshihara, Osaka, JP;

Toshiaki Ezaki, Osaka, JP;

Kazuaki Matsumoto, Osaka, JP;

Inventors:

Shusuke Yoshihara, Osaka, JP;

Toshiaki Ezaki, Osaka, JP;

Kazuaki Matsumoto, Osaka, JP;

Assignee:

Kaneka Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 63/16 (2006.01); C09K 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a thermoplastic resin which (A) remarkably improves thermal conductivity of a resin composition when a thermally conductive filler is added and (B) can be injection-molded even by use of a general injection-molding die. The thermoplastic resin is a resin wherein: a main chain which mainly has a specific repeating unit; and 60 mol % or more ends of molecular chains are carboxyl groups.


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