The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Aug. 26, 2010
Kenji Miyata, Gunma, JP;
Toshitaka Yamagata, Gunma, JP;
Kenji Miyata, Gunma, JP;
Toshitaka Yamagata, Gunma, JP;
Denki Kagaku Kogyo Kabushiki Kaisha, Tokyo, JP;
Abstract
To provide a resin composition having excellent thermal conductivity and excellent insulation reliability, a molded object, a substrate material, and a circuit board. [Solution] Provided is a resin composition which comprises an epoxy resin, a hardener, and an inorganic filler, wherein the epoxy resin and/or the hardener has a naphthalene structure, the inorganic filler comprises hexagonal boron nitride, and the inorganic filler accounts for 50-85 vol. % of the whole resin composition. Since a naphthalene structure, which imparts the satisfactory ability to wet the hexagonal boron nitride included in the inorganic filler, has been introduced into the epoxy resin and/or the hardener to heighten the inorganic-filler loading characteristics, this resin composition attains excellent heat dissipation properties, heat resistance, insulating properties, etc.
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