The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
May. 31, 2013
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Sebastian Schmidt, Dresden, DE;
Thomas Schafbauer, Ottobrunn, DE;
Hang Yip Liu, Montrose, NY (US);
Yayi Wei, Altamont, NY (US);
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/4763 (2006.01); H01L 21/302 (2006.01); H01L 23/544 (2006.01); H01L 21/66 (2006.01); H01L 21/321 (2006.01); H01L 21/82 (2006.01); G06F 17/50 (2006.01); H01L 21/762 (2006.01); H01L 21/3105 (2006.01); B81C 1/00 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
H01L 22/10 (2013.01); H01L 21/3212 (2013.01); H01L 21/82 (2013.01); G06F 17/5068 (2013.01); H01L 21/76229 (2013.01); H01L 21/31053 (2013.01); B81C 1/00539 (2013.01); H01L 21/027 (2013.01);
Abstract
A chip includes a number a plurality of functional areas of a layer and a number of dummy structures within the layer. The dummy structures are spaced from the functional areas. Each dummy structure has a size that is a function of the size and density of the functional areas.