The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2014

Filed:

Aug. 02, 2012
Applicants:

Brian I. Troy, San Mateo, CA (US);

Mickael Renault, San Jose, CA (US);

Thomas L. Maguire, Sunnyvale, CA (US);

Joseph Damian Gordon Lacey, Milpitas, CA (US);

James F. Bobey, Gilroy, CA (US);

Inventors:

Brian I. Troy, San Mateo, CA (US);

Mickael Renault, San Jose, CA (US);

Thomas L. Maguire, Sunnyvale, CA (US);

Joseph Damian Gordon Lacey, Milpitas, CA (US);

James F. Bobey, Gilroy, CA (US);

Assignee:

Cavendish Kinetics, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/82 (2006.01); H01L 21/66 (2006.01); G01R 31/26 (2014.01); H01L 21/00 (2006.01); H01L 23/28 (2006.01); G01P 15/08 (2006.01); H01L 21/70 (2006.01); B81C 1/00 (2006.01); H01H 1/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00484 (2013.01); H01H 1/0036 (2013.01); B81B 2201/018 (2013.01); B81B 2203/0118 (2013.01); H01H 2001/0089 (2013.01);
Abstract

The present invention generally relates to a MEMS device in which silicon residues from the adhesion promoter material are reduced or even eliminated from the cavity floor. The adhesion promoter is typically used to adhere sacrificial material to material above the substrate. The adhesion promoter is the removed along with then sacrificial material. However, the adhesion promoter leaves silicon based residues within the cavity upon removal. The inventors have discovered that the adhesion promoter can be removed from the cavity area prior to depositing the sacrificial material. The adhesion promoter which remains over the remainder of the substrate is sufficient to adhere the sacrificial material to the substrate without fear of the sacrificial material delaminating. Because no adhesion promoter is used in the cavity area of the device, no silicon residues will be present within the cavity after the switching element of the MEMS device is freed.


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