The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2014

Filed:

Jan. 12, 2011
Applicants:

Paul R. Elowe, Midland, MI (US);

Marty W. Degroot, Midland, MI (US);

Michael E. Mills, Midland, MI (US);

Matt A. Stempki, Midland, MI (US);

Inventors:

Paul R. Elowe, Midland, MI (US);

Marty W. DeGroot, Midland, MI (US);

Michael E. Mills, Midland, MI (US);

Matt A. Stempki, Midland, MI (US);

Assignee:

Dow Global Technologies LLC, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 31/00 (2006.01); H01L 31/0216 (2014.01); H01L 31/0224 (2006.01); H01L 31/032 (2006.01); H01L 31/0749 (2012.01);
U.S. Cl.
CPC ...
H01L 31/0749 (2013.01); Y02E 10/541 (2013.01); H01L 31/02167 (2013.01); H01L 31/022425 (2013.01); H01L 31/0322 (2013.01);
Abstract

The present invention provides strategies for improving the adhesion among two or more of transparent conducting oxides, electrically conductive grid materials, and dielectric barrier layers. As a consequence, these strategies are particularly useful in the fabrication of heterojunction photovoltaic devices such as chalcogenide-based solar cells. When the barrier is formed and then the grid is applied to vias in the barrier, the structure has improved moisture barrier resistance as compared to where the barrier is formed over or around the grid. Adhesion is improved to such a degree that grid materials and dielectric barrier materials can cooperate to provide a hermetic seal over devices to protect against damage induced by environmental conditions, including damage due to water intrusion. This allows the collection grids to be at least partially exposed above the dielectric barrier, making it easy to make electronic connection to the devices.


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