The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Sep. 28, 2007
Yasuji Kanamitsu, Ikoma, JP;
Kiminori Sato, Ikoma, JP;
Satoru Tominaga, Ikoma, JP;
Atsushi Wada, Mishima, JP;
Hiroyuki Hirano, Mishima, JP;
Yasuji Kanamitsu, Ikoma, JP;
Kiminori Sato, Ikoma, JP;
Satoru Tominaga, Ikoma, JP;
Atsushi Wada, Mishima, JP;
Hiroyuki Hirano, Mishima, JP;
Sekisui Techno Molding Co., Ltd., Nara, JP;
Abstract
A polypropylene resin composition which can produce an expansion-molded article showing excellent low-temperature impact properties even when expanded at an increased expansion rate; an expansion-molded article using the polypropylene resin composition, which has excellent low-temperature impact properties, is light in weight, and has good appearance; and a process for producing the expansion-molded article. Using a polypropylene resin composition comprising 100 weight of a polypropylene resin and 1 to 4 parts by weight of a polyethylene wax having a viscosity average molecular weight of 2400 to 3400, an expansion-molded article which is expanded at an expansion rate of 1.5 to 3 times is produced by injection expansion molding by means of a gas counter pressure technique.