The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Dec. 29, 2011
Applicants:
Kenji Mashimo, Kyoto, JP;
Syuuichi Kashimoto, Kyoto, JP;
Inventors:
Kenji Mashimo, Kyoto, JP;
Syuuichi Kashimoto, Kyoto, JP;
Assignee:
Suncall Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); B05D 3/06 (2006.01); B23K 26/34 (2014.01); B23K 26/364 (2014.01); B23K 26/22 (2006.01); B23K 26/322 (2014.01); B23K 1/005 (2006.01); G11B 5/48 (2006.01); C23C 22/72 (2006.01); C22B 9/22 (2006.01); C23C 18/14 (2006.01); C23C 18/16 (2006.01);
U.S. Cl.
CPC ...
G11B 5/482 (2013.01); C23C 22/72 (2013.01); C22B 9/223 (2013.01); C23C 18/14 (2013.01); C23C 18/1612 (2013.01); G11B 5/486 (2013.01); B23K 26/22 (2013.01); B23K 2201/38 (2013.01);
Abstract
A method of bonding a conductive material to stainless steel includes: a first step of applying a conductive paste to a surface of a base plate made of the stainless steel; and a second step of removing, in an area located within the surface of the base plate and covered with the conductive paste, a part of a passivation film on a surface of the stainless steel without allowing a base material of the stainless steel of the base plate to come into contact with air. The removing of the passivation film is achieved, for example, by irradiation of laser light.