The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2014

Filed:

Mar. 01, 2012
Applicant:

Jose-angel Mora-fillat, Loveland, CO (US);

Inventor:

Jose-Angel Mora-Fillat, Loveland, CO (US);

Assignee:

Agilent Technologies, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 99/00 (2010.01); B01J 20/285 (2006.01); B01J 20/283 (2006.01); B01L 3/00 (2006.01); B01J 20/282 (2006.01); G01N 30/60 (2006.01);
U.S. Cl.
CPC ...
B01L 3/502707 (2013.01); B01J 2219/00824 (2013.01); B01J 2219/00822 (2013.01); B01L 2300/0887 (2013.01); B01J 20/285 (2013.01); B01J 2219/00808 (2013.01); B01J 2219/00833 (2013.01); B01L 2300/0816 (2013.01); B01J 2219/00783 (2013.01); B01J 20/283 (2013.01); G01N 30/6095 (2013.01); B01J 2219/00916 (2013.01); G01N 30/6091 (2013.01); B01J 20/282 (2013.01);
Abstract

A fluidic chip device configured for processing a fluidic sample includes two outer boundary layers, and at least one reinforcing layer arranged between the two outer boundary layers and being at both of its opposing main surfaces laminated with directly adjacent layers to reinforce pressure resistance of the fluidic chip device by the lamination, in which at least a part of the layers of the fluidic chip device includes a hole forming at least a part of a fluidic conduit for conducting the fluidic sample under pressure.


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