The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2014

Filed:

Nov. 09, 2012
Applicant:

Nitto Denko Corporation, Ibaraki, JP;

Inventors:

Kaori Miki, Ibaraki, JP;

Masahito Niwa, Ibaraki, JP;

Takahiro Nonaka, Ibaraki, JP;

Masato Fujita, Ibaraki, JP;

Assignee:

Nitto Denko Corporation, Ibaraki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 38/00 (2006.01); B32B 43/00 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); B32B 2315/08 (2013.01); Y10S 156/924 (2013.01); Y10S 156/941 (2013.01); Y10S 156/943 (2013.01);
Abstract

Disclosed is a method for detaching two plates bonded through a double-coated pressure-sensitive adhesive sheet without substantially applying such a force (load) to the plates as to cause large distortion (deformation) leading to fracture or breakage of the plates. The method detaches two plates bonded through a double-coated pressure-sensitive adhesive sheet by applying a force to at least one of the two plates at least in a direction normal to the plate at such a temperature that the double-coated pressure-sensitive adhesive sheet has a storage elastic modulus of 1.0×10Pa or more as measured by dynamic viscoelastic measurement.


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