The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2014

Filed:

Feb. 16, 2011
Applicants:

Frank Kleine Jaeger, Bad Duerkheim, DE;

Juergen Kaczun, Wachenheim, DE;

Stephan Hermes, Bad Duerkheim, DE;

Inventors:

Frank Kleine Jaeger, Bad Duerkheim, DE;

Juergen Kaczun, Wachenheim, DE;

Stephan Hermes, Bad Duerkheim, DE;

Assignee:

BASF SE, Ludwigshafen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/16 (2006.01); H01L 31/05 (2014.01); C09J 11/04 (2006.01); C09J 5/00 (2006.01); C09J 9/02 (2006.01); C08K 3/04 (2006.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0504 (2013.01); C09J 2203/322 (2013.01); C08K 3/04 (2013.01); C08K 3/08 (2013.01); C09J 11/04 (2013.01); C09J 5/00 (2013.01); C09J 9/02 (2013.01); C09J 2205/31 (2013.01); Y02E 10/50 (2013.01);
Abstract

The invention relates to a process for producing electrically conductive bonds between solar cells, in which an adhesive comprising electrically conductive particles is first transferred from a carrier to the substrate by irradiating the carrier with a laser, the adhesive transferred to the substrate is partly dried and/or cured to form an adhesive layer, in a further step the adhesive is bonded to an electrical connection, and finally the adhesive layer is cured. The invention further relates to an adhesive for performing the process, comprising 20 to 98% by weight of electrically conductive particles, 0.01 to 60% by weight of an organic binder component used as a matrix material, based in each case on the solids content of the adhesive, 0.005 to 20% by weight of absorbent based on the weight of the conductive particles in the adhesive, and 0 to 50% by weight of a dispersant and 1 to 20% by weight of solvent, based in each case on the total mass of the undried and uncured adhesive.


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