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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8920079 B1

PDFFull Text
Date of Patent:
Dec. 30, 2014

Filed:

Mar. 27, 2009

Joined product

Applicants:

Kimihiro Ozaki, Nagoya, JP;

Keizo Kobayashi, Nagoya, JP;

Hideki Moriguchi, Itami, JP;

Tomoyuki Ishida, Itami, JP;

Akihiko Ikegaya, Itami, JP;

Nobuyuki Kitagawa, Itami, JP;

Inventors:

Kimihiro Ozaki, Nagoya, JP;

Keizo Kobayashi, Nagoya, JP;

Hideki Moriguchi, Itami, JP;

Tomoyuki Ishida, Itami, JP;

Akihiko Ikegaya, Itami, JP;

Nobuyuki Kitagawa, Itami, JP;

Assignees:

National Institute of Advanced Industrial Science and Technology, Tokyo, JP;

Sumitomo Electric Industries, Ltd., Osaka-shi, JP;

Sumitomo Electric Hardmetal Corp., Itami-shi, JP;

Attorneys:

Venable LLP

Michael A. Sartori

Tamatane J. Aga

Primary Examiner:

Will Fridie, Jr

Int. Cl.
CPC ...
B24D 3/00 (2006.01); B23K 1/19 (2006.01); B23K 1/00 (2006.01); B23K 35/30 (2006.01); B23K 35/00 (2006.01); C23C 16/00 (2006.01); B23K 35/32 (2006.01); B23K 20/16 (2006.01); B23K 20/02 (2006.01); E21B 10/26 (2006.01);
U.S. Cl.
CPC ...
B23K 1/19 (2013.01); B23B 2240/08 (2013.01); B23K 1/0004 (2013.01); B23B 2226/315 (2013.01); B23K 35/3046 (2013.01); B23B 2226/125 (2013.01); B23K 35/005 (2013.01); C23C 16/00 (2013.01); B23K 35/3033 (2013.01); B23K 35/325 (2013.01); B23K 20/16 (2013.01); B23K 20/021 (2013.01);
Abstract

There is provided a joined product suitable as a cutting tool that is fit for high-speed cutting, CVD coating process and the like, and does not cause a reduction in joint strength of a joining layer even if a high temperature exceeding a temperature at which a brazing filler forms the liquid phase is reached during cutting. Specifically, the joined product includes a cemented carbide sintered compact serving as a first material to be joined and a cBN sintered compact or a diamond sintered compact serving as a second material to be joined. The first material to be joined and the second material to be joined are joined by a joining material that does not form a liquid phase at a temperature lower than 1000° C. and that is placed between the first material to be joined and the second material to be joined. The joining is performed by resistance heating and pressing at a pressure of 0.1 to 200 MPa.

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