The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2014

Filed:

Feb. 27, 2014
Applicant:

Hitachi, Ltd., Toyko, JP;

Inventors:

Akio Igarashi, Tokyo, JP;

Hirokuni Kurihara, Tokyo, JP;

Ryosuke Mizutori, Toyko, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 37/00 (2006.01); B23K 3/06 (2006.01); B23K 1/20 (2006.01);
U.S. Cl.
CPC ...
B23K 3/0623 (2013.01); B23K 1/20 (2013.01);
Abstract

A solder ball printing apparatus fills plural openings formed in a mask with solder balls using a squeegee and prints the solder balls on plural electrode portions formed on a surface of a substrate facing the mask. The solder ball printing apparatus includes: a substrate mounting table on which the substrate is mounted and on the back surface side of which plural hole portions are formed; a print table on which the substrate mounting table is mounted; an XYθ stage which can drive the print table in a horizontal plane; a print table cylinder which can vertically drive the print table; a mask absorption portion which has members that can be fitted into the substrate mounting table; and a mask absorption cylinder which can vertically drive the mask absorption portion.


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