The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Feb. 04, 2008
Applicants:
Tadafumi Yoshida, Nisshin, JP;
Hiroshi Osada, Komaki, JP;
Yutaka Yokoi, Seto, JP;
Inventors:
Assignee:
Toyota Jidosha Kabushiki Kaisha, Aichi-ken, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01); F28D 17/00 (2006.01); F25D 23/12 (2006.01); H05K 7/20 (2006.01); H01L 23/34 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 23/345 (2013.01); H01L 23/34 (2013.01); H01L 23/473 (2013.01);
Abstract
A semiconductor element cooling structure includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a heat storage member attached to the semiconductor element in a manner to be located opposite to the heat sink with respect to the semiconductor element and having a case and a latent heat storage material.