The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Jul. 07, 2011
Applicant:
Junya Fukuda, Chiba, JP;
Inventor:
Junya Fukuda, Chiba, JP;
Assignee:
SII Crystal Technology Inc., Chiba, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/52 (2006.01); H03H 3/02 (2006.01); H01L 21/78 (2006.01); H01L 21/50 (2006.01); H03H 3/04 (2006.01); H03H 9/10 (2006.01); H01L 27/146 (2006.01); H01L 51/56 (2006.01); H01L 23/055 (2006.01); H03H 9/21 (2006.01); H03H 9/24 (2006.01);
U.S. Cl.
CPC ...
H01L 21/52 (2013.01); H01L 21/78 (2013.01); H03H 3/02 (2013.01); H01L 21/50 (2013.01); H03H 3/04 (2013.01); H03H 9/1021 (2013.01); H01L 27/14618 (2013.01); H01L 27/14632 (2013.01); H01L 51/56 (2013.01); H01L 23/055 (2013.01); H03H 9/21 (2013.01); H03H 9/2494 (2013.01); H03H 2003/026 (2013.01); H03H 2003/0492 (2013.01);
Abstract
A method of manufacturing packages having contents sealed therein, including: a step of forming cavities in a plurality of package forming areas on a first wafer; a step of bonding the first wafer and a second wafer while arranging the contents in the cavities; and a step of irradiating a bonded wafer member with a laser and separating the packages into pieces, characterized in that dummy cavities are formed on an outside of the package forming area in an outermost periphery of the first wafer in the cavity forming step.