The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2014

Filed:

Mar. 16, 2011
Applicants:

Yusuke Nakagawa, Kyoto, JP;

Yasuhiro Horimoto, Kusatsu, JP;

Tadashi Inoue, Yasu, JP;

Toshiyuki Takahashi, Otsu, JP;

Inventors:

Yusuke Nakagawa, Kyoto, JP;

Yasuhiro Horimoto, Kusatsu, JP;

Tadashi Inoue, Yasu, JP;

Toshiyuki Takahashi, Otsu, JP;

Assignee:

OMRON Corporation, Kyoto, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04R 9/08 (2006.01); H04R 11/04 (2006.01); H04R 17/02 (2006.01); H04R 19/04 (2006.01); H04R 21/02 (2006.01); H04R 1/04 (2006.01); H04R 1/06 (2006.01);
U.S. Cl.
CPC ...
H04R 1/04 (2013.01); H04R 1/06 (2013.01); H04R 19/04 (2013.01);
Abstract

Provided is a microphone capable of reducing a plane area seen from above, and further increasing a capacity of a back chamber of an acoustic sensor. An interposeris mounted on a top surface of a circuit board, and an acoustic sensoris mounted on the top surface thereof. A signal processing circuitis accommodated in a spaceprovided in the interposer, and mounted on the circuit board. The acoustic sensoris connected to the circuit boardthrough a wiring structure provided in the interposer. The acoustic sensor, the interposerand the like are covered by a coverput on the top surface of the circuit board. In the cover, a sound introduction holeis opened in a position opposed to the front chamber of the acoustic sensor. The interposeris formed with a ventilation notchfor acoustically communicating a space below a diaphragmof the acoustic sensorwith a space inside the coverand outside the interposer


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