The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2014

Filed:

Dec. 16, 2011
Applicants:

Masahiro Adachi, Osaka, JP;

Shinji Tokuyama, Osaka, JP;

Yohei Enya, Itami, JP;

Takashi Kyono, Itami, JP;

Yusuke Yoshizumi, Itami, JP;

Katsushi Akita, Itami, JP;

Masaki Ueno, Itami, JP;

Koji Katayama, Osaka, JP;

Takatoshi Ikegami, Itami, JP;

Takao Nakamura, Itami, JP;

Inventors:

Masahiro Adachi, Osaka, JP;

Shinji Tokuyama, Osaka, JP;

Yohei Enya, Itami, JP;

Takashi Kyono, Itami, JP;

Yusuke Yoshizumi, Itami, JP;

Katsushi Akita, Itami, JP;

Masaki Ueno, Itami, JP;

Koji Katayama, Osaka, JP;

Takatoshi Ikegami, Itami, JP;

Takao Nakamura, Itami, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 5/00 (2006.01); H01S 5/343 (2006.01); H01S 5/32 (2006.01); H01S 5/20 (2006.01); B82Y 20/00 (2011.01); H01S 5/30 (2006.01); H01S 5/22 (2006.01);
U.S. Cl.
CPC ...
H01S 5/2004 (2013.01); H01S 5/34333 (2013.01); H01S 2301/18 (2013.01); H01S 2302/00 (2013.01); H01S 5/3202 (2013.01); B82Y 20/00 (2013.01); H01S 5/309 (2013.01); H01S 5/22 (2013.01);
Abstract

Provided is a III-nitride semiconductor laser diode which is capable of lasing at a low threshold. A support base has a semipolar or nonpolar primary surface. The c-axis Cx of a III-nitride is inclined relative to the primary surface. An n-type cladding region and a p-type cladding region are provided above the primary surface of the support base. A core semiconductor region is provided between the n-type cladding region and the p-type cladding region. The core semiconductor region includes a first optical guide layer, an active layer, and a second optical guide layer. The active layer is provided between the first optical guide layer and the second optical guide layer. The thickness of the core semiconductor region is not less than 0.5 μm. This structure allows the confinement of light into the core semiconductor region without leakage of light into the support base, and therefore enables reduction in threshold current.


Find Patent Forward Citations

Loading…