The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2014
Filed:
Dec. 26, 2012
Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd., Shenzhen, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Yu-Tsan Cheng, New Taipei, TW;
Wen-Chang Chen, New Taipei, TW;
Shin-Wen Chen, New Taipei, TW;
Wen-Hsiung Chen, New Taipei, TW;
Shu-Sheng Peng, Shenzhen, CN;
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Shenzhen, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Abstract
A circuit board assembly includes a flexible circuit board, a conductive adhesive, and a number of reinforcing plates. The flexible circuit board includes a first surface and a second surface. A number of board pads are mounted on the first surface. The conductive adhesive is coated on the first surface and entirely covers all of the board pads. The reinforcing plates are positioned on the second surface. Each of the reinforcing plates spatially corresponds to a respective one of the board pads. The reinforcing plates provide both physical grounding and stiffening of the circuit board assembly.