The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2014
Filed:
Nov. 27, 2009
Yasuji Taketsuna, Okazaki, JP;
Eisaku Kakiuchi, Toyota, JP;
Katsuhiko Tatebe, Seto, JP;
Masahiro Morino, Okazaki, JP;
Tomohiro Takenaga, Toyota, JP;
Yasuji Taketsuna, Okazaki, JP;
Eisaku Kakiuchi, Toyota, JP;
Katsuhiko Tatebe, Seto, JP;
Masahiro Morino, Okazaki, JP;
Tomohiro Takenaga, Toyota, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota-Shi, JP;
Abstract
A semiconductor device and a method of producing the same, wherein a joining member and a joined member are bonded by means of brazing in a way such that no voids are left inside the joining layer. The semiconductor device comprises a joined member and a joining member which is joined to the joined member by means of brazing. The joined member is provided with a through hole which is open on the joining surface with the joining member, and a path communicating with the through hole is provided on at least one of the joining surface of the joining member with the joined member or the joining surface of the member with the joining member.