The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2014

Filed:

Oct. 07, 2010
Applicants:

Jean-michel Morelle, Beaugency, FR;

KY Lim Tan, Maisons-Alfort, FR;

Laurent Vivet, Bois D'arcy, FR;

Sandra Dimelli, Bois D'arcy, FR;

Stéphane Thomelin, Richebourg, FR;

Hervé Lorin, Coignieres, FR;

Patrick Dubus, Saint Forget, FR;

Inventors:

Jean-Michel Morelle, Beaugency, FR;

Ky Lim Tan, Maisons-Alfort, FR;

Laurent Vivet, Bois D'arcy, FR;

Sandra Dimelli, Bois D'arcy, FR;

Stéphane Thomelin, Richebourg, FR;

Hervé Lorin, Coignieres, FR;

Patrick Dubus, Saint Forget, FR;

Assignee:

Valeo Etudes Electroniques, Créteil Cedex, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H05K 3/30 (2006.01); H05K 7/00 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); H01L 25/18 (2006.01); H01L 25/07 (2006.01); H05K 1/14 (2006.01); H01L 23/10 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01); H01L 23/49833 (2013.01); H01L 2224/02335 (2013.01); H01L 23/10 (2013.01); H01L 24/73 (2013.01); H01L 2924/01047 (2013.01); H01L 2224/732 (2013.01); H01L 2224/13099 (2013.01); H05K 2201/042 (2013.01); H01L 2224/48091 (2013.01); H01L 24/48 (2013.01); H01L 23/36 (2013.01); H01L 2924/01058 (2013.01); H01L 25/18 (2013.01); H01L 24/13 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/45014 (2013.01); H05K 3/0061 (2013.01); H01L 2924/014 (2013.01); H01L 24/16 (2013.01); H01L 25/074 (2013.01); H01L 2224/0233 (2013.01); H01L 2924/01033 (2013.01); H01L 24/72 (2013.01); H01L 2924/13055 (2013.01); H01L 2224/48227 (2013.01); H05K 2201/1053 (2013.01);
Abstract

The invention relates to a power module (), preferably for a vehicle, in particular an electric vehicle, characterized in that said module includes two vertically adjacent semiconducting chips (), each chip having a first surface () to be connected to a heat sink substrate (), and a second surface () separate from the first and on which at least one electronic component (-) is arranged, the module being arranged such that the second surfaces of the chips are arranged opposite one another.


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