The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2014
Filed:
Apr. 24, 2009
Applicants:
Chong Yee Tong, Melaka, MY;
Hui Teng Wang, Muar, MY;
Inventors:
Chong Yee Tong, Melaka, MY;
Hui Teng Wang, Muar, MY;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/055 (2006.01); H01L 25/065 (2006.01); H01L 23/20 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/055 (2013.01); H01L 2224/16 (2013.01); H01L 2924/01029 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/45144 (2013.01); H01L 23/49827 (2013.01); H01L 25/0652 (2013.01); H01L 2924/16172 (2013.01); H01L 2924/19107 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48465 (2013.01); H01L 25/0657 (2013.01); H01L 2924/16152 (2013.01); H01L 23/20 (2013.01); H01L 24/48 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/01068 (2013.01); H01L 2225/0651 (2013.01); H01L 2924/16747 (2013.01); H01L 2225/06517 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A semiconductor package includes a first semiconductor chip, a second semiconductor chip, a first substrate, a second substrate and a metal cap. The chips are electrically connected to the first substrate, the second substrate is disposed between the chips, and the chips and the second substrate are disposed within the metal cap.