The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2014
Filed:
Jul. 20, 2011
Applicant:
Chi-jang Lo, Hsin-Chu, TW;
Inventor:
Chi-Jang Lo, Hsin-Chu, TW;
Assignee:
Aptos Technology Inc., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 23/49548 (2013.01); H01L 23/3107 (2013.01); H01L 24/08 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/08245 (2013.01);
Abstract
A package structure and a package process are provided. The package structure comprises a carrier having a carrying portion and a plurality of supporting bar remnants disposed around and extending outward from the carrying portion, a chip mounted to the carrying portion, and an encapsulant disposed on the carrier and covering the chip, wherein the supporting bar remnants are encapsulated by the encapsulant, and each of the supporting bar remnants has a distal end shrank from an outer surface of the encapsulant. A package process for fabricating the package structure is also provided.