The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2014

Filed:

Apr. 28, 2010
Applicants:

Georg Bogner, Lappersdorf, DE;

Stefan Gruber, Bad Abbach, DE;

Inventors:

Georg Bogner, Lappersdorf, DE;

Stefan Gruber, Bad Abbach, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/26 (2010.01); H05K 1/18 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); H01L 25/167 (2013.01); H05K 1/181 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/049 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01);
Abstract

An optoelectronic module includes a radiation-emitting semiconductor component, an electrical component and a carrier substrate. The carrier substrate includes a top and a bottom, wherein first electrical connections are arranged on the bottom and second electrical connections are arranged on the top. The electrical component is arranged on the top of the carrier substrate and is electrically conductively connected with the first electrical connections. The radiation-emitting semiconductor component is arranged on the side of the electrical component remote from the carrier substrate. The radiation-emitting semiconductor component furthermore includes conductive structures electrically conductively connected with the second electrical connections.


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