The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2014

Filed:

Apr. 26, 2013
Applicant:

Neobulb Technologies, Inc., Bandar Seri Begawan, BN;

Inventor:

Jen-Shyan Chen, Zhubei, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/20 (2010.01); H01L 31/173 (2006.01); H01L 33/32 (2010.01); H01L 33/34 (2010.01);
U.S. Cl.
CPC ...
H01L 33/20 (2013.01); H01L 31/173 (2013.01); H04L 33/005 (2013.01); H01L 33/32 (2013.01); H01L 33/34 (2013.01);
Abstract

The present invention discloses an integral LED component which integrates LED epitaxial structures electrodes and interconnect with a package substrate together and an integral manufacturing process thereof. The integral LED component can be made with multiple epitaxial structures or with just a single epitaxial structure. The integral LED component can be mounted into a hollow carrier. And by having support by the hollow carrier, the package substrate can be mounted and contacted with a heat conductive or a dissipation device. The integral LED component is fabricated by wafer level process and cut from the wafer as an independent component. By different manufacturing process, the integral LED component can be made as Vertical LED structure or Lateral LED structure.


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