The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2014
Filed:
Mar. 14, 2012
Applicant:
Jongjoo Lee, Suwon-si, KR;
Inventor:
Jongjoo Lee, Suwon-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 23/02 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/03 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 24/73 (2013.01); H01L 25/03 (2013.01); H01L 2924/37001 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/131 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06596 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/1579 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01); H01L 2924/15791 (2013.01); H01L 22/32 (2013.01);
Abstract
Provided is a semiconductor package and a chip package of the same. The semiconductor package includes: a first semiconductor chip mounted on a first package substrate; a chip package stacked on the first semiconductor chip; and a first terminal connecting the chip package directly and electrically to the first semiconductor chip, wherein the chip package includes a second semiconductor chip mounted on a second package substrate, and the second package substrate includes a first pad coupled to the first terminal and a second pad electrically connected to the first pad and electrically spaced apart from the first terminal.