The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2014

Filed:

Jul. 11, 2014
Applicant:

Inoso, Llc, Austin, TX (US);

Inventors:

Ziep Tran, Austin, TX (US);

Kiyoshi Mori, Missouri City, TX (US);

Giang Trung Dao, Milpitas, CA (US);

Michael Edward Ramon, Austin, TX (US);

Assignee:

Inoso, LLC, Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 29/88 (2006.01); H01L 29/872 (2006.01); H01L 29/66 (2006.01); H01L 21/265 (2006.01); H01L 29/04 (2006.01); H01L 27/22 (2006.01); H01L 27/24 (2006.01);
U.S. Cl.
CPC ...
H01L 29/872 (2013.01); H01L 29/66143 (2013.01); H01L 21/26506 (2013.01); H01L 29/04 (2013.01); H01L 27/224 (2013.01); H01L 27/2427 (2013.01); Y10S 438/979 (2013.01);
Abstract

A method of forming a stacked low temperature diode and related devices. At least some of the illustrative embodiments are methods comprising forming a metal interconnect disposed within an inter-layer dielectric. The metal interconnect is electrically coupled to at least one underlying integrated circuit device. A barrier layer is deposited on the metal interconnect and the inter-layer dielectric. A semiconductor layer is deposited on the barrier layer. A metal layer is deposited on the semiconductor layer. The barrier layer, the semiconductor layer, and the metal layer are patterned. A low-temperature anneal is performed to induce a reaction between the patterned metal layer and the patterned semiconductor layer. The reaction forms a silicided layer within the patterned semiconductor layer. Moreover, the reaction forms a P-N junction diode.


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