The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2014

Filed:

Feb. 20, 2012
Applicants:

Jeffrey L. Dalsin, Verona, WI (US);

Bruce P. Lee, Houghton, MI (US);

Laura Vollenweider, Lodi, WI (US);

Sunil Silvary, Madison, WI (US);

John L. Murphy, Verona, WI (US);

Fangmin Xu, Sudbury, MA (US);

Amanda Spitz, Madison, WI (US);

Arinne Lyman, Fitchburg, WI (US);

Inventors:

Jeffrey L. Dalsin, Verona, WI (US);

Bruce P. Lee, Houghton, MI (US);

Laura Vollenweider, Lodi, WI (US);

Sunil Silvary, Madison, WI (US);

John L. Murphy, Verona, WI (US);

Fangmin Xu, Sudbury, MA (US);

Amanda Spitz, Madison, WI (US);

Arinne Lyman, Fitchburg, WI (US);

Assignee:

Kensey Nash Corporation, Exton, PA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08L 21/02 (2006.01); A61L 29/14 (2006.01); A01N 37/38 (2006.01); A61L 31/10 (2006.01); A61L 24/04 (2006.01); A61B 17/08 (2006.01); A61L 31/14 (2006.01); C09J 171/02 (2006.01); A61L 15/46 (2006.01); A61L 31/16 (2006.01); C08G 65/331 (2006.01); A61L 15/60 (2006.01); A01N 37/40 (2006.01); A61L 27/52 (2006.01); C09D 5/16 (2006.01); A61L 27/34 (2006.01); A61L 15/44 (2006.01); A61L 27/54 (2006.01); A61L 29/16 (2006.01); A01N 47/28 (2006.01); A61L 27/50 (2006.01); A61L 29/08 (2006.01); A01N 47/12 (2006.01); A61L 15/42 (2006.01); A01N 37/44 (2006.01); C08G 65/333 (2006.01); A61B 17/06 (2006.01); A61B 17/00 (2006.01); A61B 17/064 (2006.01); A61F 2/00 (2006.01);
U.S. Cl.
CPC ...
A01N 47/12 (2013.01); A61L 29/145 (2013.01); A01N 37/38 (2013.01); A61L 29/14 (2013.01); A61L 31/10 (2013.01); A61L 24/04 (2013.01); A61B 17/08 (2013.01); A61L 31/145 (2013.01); C09J 171/02 (2013.01); A61B 17/06166 (2013.01); A61L 15/46 (2013.01); A61L 31/16 (2013.01); C08G 65/3317 (2013.01); A61L 15/60 (2013.01); A01N 37/40 (2013.01); A61L 27/52 (2013.01); A61B 2017/00951 (2013.01); C09D 5/1637 (2013.01); A61L 27/34 (2013.01); A61B 17/064 (2013.01); A61F 2002/0086 (2013.01); A61L 15/44 (2013.01); A61L 27/54 (2013.01); A61L 29/16 (2013.01); A01N 47/28 (2013.01); A61L 27/50 (2013.01); A61L 29/085 (2013.01); A61L 15/42 (2013.01); A61F 2/0063 (2013.01); C08L 2203/02 (2013.01); A61B 17/085 (2013.01); A01N 37/44 (2013.01); C08G 65/33396 (2013.01); A61L 31/14 (2013.01);
Abstract

The invention describes families of compounds that utilize multihydroxyl phenyl groups to provide adhesive properties. Selection of the multihydroxy phenyl group along with linkers or linking groups and the linkages between the linkers or linking groups with polyalkylene oxides, provides materials that can be engineered to afford controllable curing time, biodegradation and/or swelling.


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