The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2014

Filed:

Jan. 19, 2011
Applicants:

Jin HU, Hudson, OH (US);

Claire Hartmann-thompson, Midland, MI (US);

Dale J. Meier, Midland, MI (US);

Petar R. Dvornic, Midland, MI (US);

Inventors:

Jin Hu, Hudson, OH (US);

Claire Hartmann-Thompson, Midland, MI (US);

Dale J. Meier, Midland, MI (US);

Petar R. Dvornic, Midland, MI (US);

Assignee:

Michigan Molecular Institute, Midland, MI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08G 77/18 (2006.01); C07F 7/21 (2006.01); C09J 183/06 (2006.01); C08K 5/549 (2006.01);
U.S. Cl.
CPC ...
G08G 77/04 (2013.01); C08K 5/549 (2013.01);
Abstract

The HBP Free-POSS compounds of Formula I are superior to prior HB polymers and linear polymers in space and electronic applications because they have better resistance to electrons, protons and atomic oxygen, have superior out-gassing performance, and are transparent. They are used as coatings, films, adhesives, sealants and elastomers.


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