The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2014
Filed:
Nov. 20, 2013
Hitachi Media Electronics Co., Ltd., Yokohama-shi, Kanagawa, JP;
Ryuta Washiya, Tokyo, JP;
Masahiko Ogino, Tokyo, JP;
Shiro Nagashima, Yokohama, JP;
Akio Yabe, Yokohama, JP;
Masaki Sugita, Yokohama, JP;
Akihiro Miyauchi, Tokyo, JP;
Hitachi-LG Data Storage, Inc., Tokyo, JP;
Abstract
Provided are a method for forming a microfine structure and a microfine structure forming body prepared by the method. The method allows a remaining film part to be formed thinner and more uniform on a substrate than the conventional techniques. The method comprises the steps of: forming an oxide layer on a metallic thin film; a photocurable resin layer via first and second adhesive layers over the oxide layer; and transferring a microfine structure formed on a mold by pressing the mold onto the photocurable resin layer. The first adhesive layer includes a compound having at least two hydrolysable functional groups, and the second adhesive layer includes a compound having at least a hydrolysable functional group and a reactive functional group.