The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2014
Filed:
Nov. 21, 2012
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Gopalakrishnan Trichy Rengarajan, Villach, AT;
Armin Tilke, Villach, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/31 (2006.01); H01L 21/78 (2006.01); H01L 21/683 (2006.01); H01L 23/482 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/6835 (2013.01); H01L 23/482 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01);
Abstract
A semiconductor wafer includes a first main face and a second main face opposite to the first main face and a number of semiconductor chip regions. The wafer is diced along dicing streets to separate the semiconductor chip regions from each other. At least one metal layer is formed on the first main face of each one of the semiconductor chip regions.
Quick Actions:
Trichy Rengarajan, Gopalakrishnan. (2014). Method for manufacturing an electronic component (U.S. Patent No. 8916453). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8916453
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile