The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2014
Filed:
Dec. 01, 2009
Applicants:
Wenjie HU, Beijing, CN;
Zenghui Sun, Beijing, CN;
Hongyu Liu, Beijing, CN;
Gang Wang, Beijing, CN;
Xibin Shao, Beijing, CN;
Inventors:
Wenjie Hu, Beijing, CN;
Zenghui Sun, Beijing, CN;
Hongyu Liu, Beijing, CN;
Gang Wang, Beijing, CN;
Xibin Shao, Beijing, CN;
Assignee:
Boe Technology Group Co., Ltd., Beijing, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/12 (2006.01); H01L 21/28 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 27/1214 (2013.01); H01L 27/1288 (2013.01); H01L 21/28 (2013.01); H01L 33/00 (2013.01);
Abstract
A method for manufacturing E-paper array substrate and an E-paper array substrate are provided. The method for manufacturing E-paper array substrate uses two masks. Steps on a surface of the array substrate structure are eliminated, so as to facilitate a subsequent coating process of E-ink and enable a uniform distribution of a drain electric field. An E-paper array substrate is further provided.