The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2014
Filed:
Apr. 30, 2010
Applicant:
Ronny Ludwig, Reutlingen, DE;
Inventor:
Ronny Ludwig, Reutlingen, DE;
Assignee:
Robert Bosch GmbH, Stuttgart, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 69/02 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3135 (2013.01); H01L 21/565 (2013.01); H01L 2924/1433 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/19105 (2013.01);
Abstract
A method for producing an electronic component includes: providing at least one carrier element having a microcomponent receptacle configured for contacting at least one microcomponent, injection molding a housing around the carrier element, the microcomponent receptacle being situated in a cavity of the housing that is open on at least one side, introducing the microcomponent into the microcomponent receptacle in the cavity to contact the microcomponent to the carrier element, and injecting the cavity using a filler material to fix the microcomponent in the housing and in the microcomponent receptacle.