The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2014
Filed:
Dec. 25, 2008
Kimitaka Sato, Okayama, JP;
Taku Okano, Kyoto, JP;
Taro Nakanoya, Okayama, JP;
Dowa Electronics Materials Co., Ltd., Tokyo, JP;
Abstract
Provided is a silver micropowder coated with a protective material and capable of more drastically reducing the sintering temperature than before. The silver micropowder comprises silver particles processed to adsorb hexylamine (CH—NH) on the surfaces thereof and having a mean particle diameter Dof from 3 to 20 nm or an X-ray crystal particle diameter Dof from 1 to 20 nm. The silver micropowder has the property of forming a conductive film having a specific resistivity of not more than 25 μΩ·cm when it is mixed with an organic medium to prepare a silver coating material and when a coating film formed of it is fired in air at 120° C. Even when fired at 100° C., it may form a conductive film having a specific resistivity of not more than 25 μΩ·cm. The silver micropowder can be produced by mixing a silver particle dispersion, as monodispersed in an organic medium, of silver particles coated with a primary amine A having an unsaturated bond and having a molecular weight of from 200 to 400, and hexylamine, and then keeping the mixture at 5 to 80° C. with stirring to thereby form precipitated particles.