The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2014

Filed:

Mar. 24, 2010
Applicant:

Naoki Kakuta, Makinohara, JP;

Inventor:

Naoki Kakuta, Makinohara, JP;

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/18 (2006.01); H01R 13/03 (2006.01); H01R 4/62 (2006.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); H01R 4/62 (2013.01); H01R 4/185 (2013.01); Y10S 428/929 (2013.01); Y10S 428/935 (2013.01);
Abstract

A connector terminal which can achieve high mechanical connection strength and stabilized low electrical connection resistance when it is crimped to an aluminum electric wire, and in addition, can suppress electrical contact resistance low when it is fitted to a mating connector terminal is provided. In a connector terminal (A) having an electrical contact section () which is brought into contact and conducted with a mating connector terminal by fitting to the mating connector terminal, and a conductor crimping section () which is crimped to the conductor of an electric wire, a metal material which constitutes the terminal uses aluminum or an aluminum alloy as a base material (), a Zn layer () having a thickness in the range from 0.1 μm to 2.0 μm by electroless plating and a Cu layer () having a thickness in the range from 0.5 μm to 1.0 μm by electrolytic plating are formed in sequence on the surface of the base material (), and an Sn layer () having a thickness in the range from 0.7 μm to 1.7 μm by electrolytic plating is formed on the outermost surface.


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