The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2014

Filed:

Apr. 15, 2013
Applicant:

Kitagawa Industries Co., Ltd., Inazawa-shi, Aichi, JP;

Inventor:

Tomohisa Kurita, Kasugai, JP;

Assignee:

Kitagawa Industries Co., Ltd., Inazawa-shi, Aichi, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/6595 (2011.01); H01R 4/48 (2006.01); H05K 9/00 (2006.01); H01R 12/71 (2011.01);
U.S. Cl.
CPC ...
H01R 4/48 (2013.01); H01R 13/6595 (2013.01); H05K 9/0035 (2013.01); H01R 12/718 (2013.01);
Abstract

A surface mount clip includes a base part having a rear surface electrically connected to a conductor part of a printed wiring board; and an extension part extending from the base part. The extension part contacts with a conductive member attached to the printed wiring board with elastic deformation of the extension part to hold the conductive member and make electrical connection thereto. The base part includes a solder-bonding part having a bonding plane to be bonded with the printed wiring board and a floating part forming a gap from the printed wiring board in a state that the solder-bonding part is solder-bonded to the printed wiring board. The extension part includes a root part extending from the floating part toward the rear surface of the base part and a folded-back part extending from an end of the root part toward a front surface of the base part.


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