The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2014

Filed:

Apr. 09, 2013
Applicant:

Cicor Management Ag, Zürich, CH;

Inventors:

Ernst Feurer, Blaustein, DE;

Bruno Holli, Ulm, DE;

Alexander Kaiser, Schemmerhofen, DE;

Karin Ruess, Stuttgart, DE;

Assignee:

Cicor Management AG, Zurich, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/00 (2013.01); H05K 3/007 (2013.01); H05K 2201/0154 (2013.01); H05K 2203/0169 (2013.01); H05K 2203/0271 (2013.01); Y10S 269/90 (2013.01); Y10S 269/903 (2013.01);
Abstract

A method is specified for the production of a flexible circuit configuration, which allows the manufacturing of such flexible circuits on a carrier film cost-effectively and with high precision. For this purpose, the carrier film is fastened at the beginning of the method on a rigid frame, which encloses an inner area, and spans the inner area using an inner surface. After finishing of a layer structure and optionally additional method steps, structures for flexible circuit configurations which are created over the inner surface may be cut out easily by cutting the flexible circuit configurations out of the inner surface as a cutout. Through the fastening of the carrier film on the frame, it is ensured during the various method steps of the production of the flexible circuit configuration that the carrier film, which is flexible per se, always forms a level foundation for the various method measures, in particular the photolithographic structuring of layers of a layer structure.


Find Patent Forward Citations

Loading…