The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2014

Filed:

Feb. 21, 2011
Applicants:

Elad Dayan, Beit-Dagan, IL;

Yigal Leiba, Holon, IL;

Baruch Schwarz, Raanana, IL;

Amir Shmuel, Nofit, IL;

Inventors:

Elad Dayan, Beit-Dagan, IL;

Yigal Leiba, Holon, IL;

Baruch Schwarz, Raanana, IL;

Amir Shmuel, Nofit, IL;

Assignee:

Siklu Communication Ltd., Petach-Tikva, IL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 11/00 (2006.01); H01P 5/107 (2006.01); H01P 3/12 (2006.01);
U.S. Cl.
CPC ...
H01P 5/107 (2013.01); H01P 11/003 (2013.01); H01P 3/121 (2013.01); H01P 11/002 (2013.01);
Abstract

A method for constructing millimeter-wave laminate structures using Printed Circuit Board (PCB) processes includes the following steps: Creating a first pressed laminate structure comprising at least two laminas and a cavity, the cavity is shaped as an aperture of a waveguide, and goes perpendicularly through all laminas of the laminate structure. Plating the cavity with electrically conductive plating, using a PCB plating process. Pressing the first pressed laminate structure together with at least two additional laminas comprising a probe printed on one of the at least two additional laminas, into a PCB comprising the first pressed laminate structure and the additional laminas, such that the cavity is sealed only from one end by the additional laminas and the probe, and the probe is positioned above the cavity.


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