The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2014

Filed:

Jul. 07, 2011
Applicants:

Eiju Hirai, Okaya, JP;

Hiroshi Ito, Suwa, JP;

Toshihiro Shimizu, Fujimi-machi, JP;

Jiro Kato, Suwa, JP;

Inventors:

Eiju Hirai, Okaya, JP;

Hiroshi Ito, Suwa, JP;

Toshihiro Shimizu, Fujimi-machi, JP;

Jiro Kato, Suwa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 17/00 (2006.01); H01L 41/332 (2013.01); B41J 2/14 (2006.01); B41J 2/16 (2006.01); H01L 41/29 (2013.01);
U.S. Cl.
CPC ...
H01L 41/332 (2013.01); B41J 2/14233 (2013.01); B41J 2/161 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); B41J 2/1642 (2013.01); B41J 2/1645 (2013.01); B41J 2/1646 (2013.01); H01L 41/29 (2013.01);
Abstract

A method for manufacturing a piezoelectric element includes a process for forming a first conductive layer, a process for forming a piezoelectric layer having a region serving as an active region, a process for forming a second conductive layer, which overlaps with the region, a process for forming a third conductive layer, which overlaps with the region, on the second conductive layer, a process for forming an opening portion that divides the third conductive layer into a first portion and a second portion, a process for forming a resist layer that covers the opening portion and a peripheral portion at the side of the opening portion of the first portion and the second portion; a process for etching the third conductive layer to form a first conductive portion and a second conductive portion, and a process for etching the second conductive layer to form a third conductive portion.


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