The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2014

Filed:

May. 02, 2014
Applicant:

Siemens Plc, Frimley, Camberley, GB;

Inventor:

Simon James Calvert, Oxfordshire, GB;

Assignee:

Siemens PLC, Camberley, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 39/24 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a method or joint for joining first and second semiconductor wires, each comprising a number of filaments which each comprise a superconductive core within a respective sheath, the filaments being embedded within a matrix and wherein the superconductive cores comprise magnesium diboride and the sheaths comprise niobium, over a certain length a matrix is removed to expose the filaments. The exposed filaments are immersed in molten tin such that the nobium of the sheaths is converted to niobium-tin throughout a thickness of the sheaths. A superconductive path is provided between the superconductive cores of filaments of the first wire through the niobium-tin sheaths of the filaments to the superconductive cores of the second wire.


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