The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2014
Filed:
Jul. 03, 2013
Nitto Denko Corporation, Ibaraki, JP;
Eiji Toyoda, Ibaraki, JP;
Yusaku Shimizu, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
Provided are a sealing resin sheet, wherein a clean, smooth and flat ground surface is obtained by grinding after resin sealing, a method for producing an electronic component package using the same, and an electronic component package obtained by the production method. The present invention provides a sealing resin sheet, wherein a ground surface has a mean surface roughness Ra of 1 μm or less when grinding is performed under conditions of a grind bite peripheral velocity of 1000 m/minute, a feed pitch of 100 μm and a cut depth of 10 μm after a heat curing treatment is performed at 180° C. for 1 hour; and a Shore D hardness at 100° C. after the heat curing treatment is 70 or more.