The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2014

Filed:

Dec. 21, 2012
Applicant:

Io Semiconductor, Inc., San Diego, CA (US);

Inventors:

Michael A. Stuber, Carlsbad, CA (US);

Stuart B. Molin, Carlsbad, CA (US);

Mark Drucker, Poway, CA (US);

Peter Fowler, Poway, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 27/06 (2006.01); H01L 23/498 (2006.01); H01L 29/786 (2006.01); H01L 25/00 (2006.01); H01L 21/84 (2006.01); H01L 21/78 (2006.01); H01L 25/065 (2006.01); H01L 27/12 (2006.01); H01L 21/762 (2006.01); H01L 23/00 (2006.01); H01L 27/092 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 2224/80048 (2013.01); H01L 2224/9222 (2013.01); H01L 2224/11 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/92242 (2013.01); H01L 2224/16227 (2013.01); H01L 27/0688 (2013.01); H01L 21/76256 (2013.01); H01L 2924/10253 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/16225 (2013.01); H01L 24/48 (2013.01); H01L 24/94 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/13113 (2013.01); H01L 2924/01015 (2013.01); H01L 2224/05684 (2013.01); H01L 24/16 (2013.01); H01L 2224/81815 (2013.01); H01L 24/83 (2013.01); H01L 24/13 (2013.01); H01L 2924/01047 (2013.01); H01L 24/85 (2013.01); H01L 24/11 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/05666 (2013.01); H01L 29/78603 (2013.01); H01L 25/50 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/45124 (2013.01); H01L 2225/06565 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/01322 (2013.01); H01L 24/81 (2013.01); H01L 2924/01012 (2013.01); H01L 2225/06513 (2013.01); H01L 21/84 (2013.01); H01L 2224/13147 (2013.01); H01L 24/92 (2013.01); H01L 21/78 (2013.01); H01L 2224/13105 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/05611 (2013.01); H01L 24/32 (2013.01); H01L 2225/0651 (2013.01); H01L 2224/8385 (2013.01); H01L 29/78606 (2013.01); H01L 25/0652 (2013.01); H01L 27/092 (2013.01); H01L 25/0657 (2013.01); H01L 24/80 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06517 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/8382 (2013.01); H01L 27/1203 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/92247 (2013.01);
Abstract

An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface. A first active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the first active layer and formed on the second surface of the insulating layer. A substrate having a first surface and a second surface, with a second active layer formed in the first surface, is provided such that the first active layer is coupled to the second surface of the substrate.


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