The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2014
Filed:
Mar. 29, 2012
Elad Danny, Moshav Liman, IL;
Kaminski Noam, Kiryat Tivon, IL;
Okamoto Keishi, Kawasaki, JP;
Shumaker Evgeny, Nesher, IL;
Toriyama Kazushige, Yamato, JP;
Elad Danny, Moshav Liman, IL;
Kaminski Noam, Kiryat Tivon, IL;
Okamoto Keishi, Kawasaki, JP;
Shumaker Evgeny, Nesher, IL;
Toriyama Kazushige, Yamato, JP;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A mmWave electronics package constructed from common Printed Circuit Board (PCB) technology and a metal cover. Assembly of the package uses standard pick and place technology and heat is dissipated directly to a pad on the package. Input/output of mmWave signal(s) is achieved through a rectangular waveguide. Mounting of the electronic package to an electrical printed circuit board (PCB) is performed using conventional reflow soldering processes and includes a waveguide I/O connected to an mmWave antenna. The electronic package provides for transmission of low frequency, dc and ground signals from the semiconductor chip inside the package to the PCB it is mounted on. An impedance matching scheme matches the chip to high frequency board transition by altering the ground plane within the chip. A ground plane on the high frequency board encircles the high frequency signal bump to confine the electromagnetic fields to the bump region reducing radiation loss.