The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2014

Filed:

Dec. 18, 2012
Applicant:

SK Hynix Inc., Gyeonggi-do, KR;

Inventor:

Min Gyu Koo, Gyeonggi-do, KR;

Assignee:

SK Hynix Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/118 (2006.01); H01L 29/788 (2006.01); H01L 21/28 (2006.01); H01L 21/02 (2006.01); H01L 27/115 (2006.01);
U.S. Cl.
CPC ...
H01L 29/788 (2013.01); H01L 29/7881 (2013.01); H01L 21/28273 (2013.01); H01L 21/02365 (2013.01); H01L 27/11524 (2013.01);
Abstract

The semiconductor device includes a semiconductor substrate having a first active area defined by a first isolation layer; a gate insulating layer formed on the semiconductor substrate; a first conductive layer formed on the gate insulating layer; a dielectric layer formed on the first conductive layer; at least one first contact hole passing through the dielectric layer; a second conductive layer, formed on the dielectric layer, the second conductive layer filling the at least one first contact hole to contact the first conductive layer; and at least one first contact plug connected to the second conductive layer in the first active area, wherein the at least one first contact plug is offset from the at least one first contact hole to overlap the dielectric layer.


Find Patent Forward Citations

Loading…