The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2014

Filed:

Dec. 17, 2012
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Xiang Liu, Beijing, CN;

Woobong Lee, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/10 (2006.01); H01L 29/12 (2006.01); H01L 29/04 (2006.01); H01L 31/036 (2006.01); H01L 31/0376 (2006.01); H01L 31/20 (2006.01); H01L 29/15 (2006.01); H01L 21/00 (2006.01); H01L 21/84 (2006.01); G02F 1/1368 (2006.01); H01L 29/786 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 27/127 (2013.01); G02F 1/1368 (2013.01); H01L 29/78618 (2013.01); H01L 27/1225 (2013.01); H01L 29/78693 (2013.01);
Abstract

Embodiments of the present invention provide a thin film transistor array substrate, a method for manufacturing the same, a display panel and a display device. The method for manufacturing the thin film transistor array substrate comprises: sequentially depositing a first metal oxide layer, a second metal oxide layer and a source and drain metal layer, conductivity of the first metal oxide layer being smaller than conductivity of the second metal oxide layer; patterning the first metal oxide layer, the second metal oxide layer and the source and drain metal layer, so as to form an active layer, a buffer layer, a source electrode and a drain electrode, respectively. According to technical solutions of the embodiments of the invention, it is possible that the manufacturing process of the metal oxide TFT array substrate is simplified, and the production cost of products is reduced.


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