The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2014

Filed:

Oct. 09, 2012
Applicant:

Fischer Technology Pte. Ltd., Singapore, SG;

Inventors:

Chee Seng Leong, Singapore, SG;

Sze Lam Chua, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H01R 43/00 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H03K 17/96 (2006.01); H05K 7/02 (2006.01); B29C 53/04 (2006.01); B29L 31/34 (2006.01); B29C 45/14 (2006.01); B29C 45/16 (2006.01);
U.S. Cl.
CPC ...
H05K 3/10 (2013.01); H03K 17/9622 (2013.01); H05K 7/02 (2013.01); H03K 2217/960755 (2013.01); H03K 2217/960785 (2013.01); B29C 53/04 (2013.01); B32B 2457/00 (2013.01); B29L 2031/3437 (2013.01); B29C 45/14811 (2013.01); B29C 45/1671 (2013.01);
Abstract

A method includes patterning one or more electrical layers on a substrate; shaping the patterned substrate into a 3-dimensional contour, wherein the contour including a significant change in gradient in or adjacent to one or more sensing areas of the electrical layer, and over-molding the shaped substrate. Degradation of a trace in the electrical layer at or adjacent to the one or more sensing areas during shaping and/or over-molding is substantially minimized based on the width of the trace, the thickness or number of layers of the trace, the bending radius of the trace, the material of the trace, and/or a primer over layer on the trace.


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