The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2014
Filed:
Sep. 18, 2012
Dow Corning Toray Co., Ltd., Tokyo, JP;
Yusuke Miyamoto, Ichihara, JP;
Makoto Yoshitake, Ichihara, JP;
Dow Corning Toray Co., Ltd., Chiyoda-Ku, Tokyo, JP;
Abstract
A curable silicone composition for sealing an optical semiconductor element, comprising: (A) an organopolysiloxane that has at least two silicon-bonded vinyl groups in one molecule, that has Calkyl for the other silicon-bonded organic groups therein, and that lacks a siloxane unit represented by the following formula: SiO; (B) an organopolysiloxane represented by an average unit formula; (C) an organopolysiloxane that has at least three silicon-bonded hydrogen atoms in one molecule, that has Calkyl for the silicon-bonded organic groups therein, and that contains from 0.7 to 1.6 mass % of silicon-bonded hydrogen atoms; and (D) a hydrosilylation reaction catalyst, wherein a viscosity at 25° C. and a viscosity at 100° C. of this composition lacking component (D) reside in a specific relationship, can efficiently perform resin sealing by transfer molding or compression molding while exhibiting an excellent moldability and can provide a cured product that has a low surface tack.