The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2014

Filed:

Oct. 20, 2010
Applicants:

Daisuke Hattori, Ibaraki, JP;

Toshiyuki Iida, Ibaraki, JP;

Takeshi Murashige, Ibaraki, JP;

Takashi Yamaoka, Ibaraki, JP;

Tatsuki Nagatsuka, Ibaraki, JP;

Inventors:

Daisuke Hattori, Ibaraki, JP;

Toshiyuki Iida, Ibaraki, JP;

Takeshi Murashige, Ibaraki, JP;

Takashi Yamaoka, Ibaraki, JP;

Tatsuki Nagatsuka, Ibaraki, JP;

Assignee:

Nitto Denko Corporation, Ibaraki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 17/34 (2006.01); H01L 31/0216 (2014.01); H02S 30/00 (2014.01); C08G 63/193 (2006.01); H01L 31/042 (2014.01); C03C 17/32 (2006.01); C09D 167/02 (2006.01); B32B 17/06 (2006.01);
U.S. Cl.
CPC ...
C08G 63/193 (2013.01); H02S 30/00 (2013.01); H01L 31/0216 (2013.01); C03C 17/324 (2013.01); C03C 17/32 (2013.01); C03C 17/34 (2013.01); C03C 17/326 (2013.01); C03C 17/3405 (2013.01); C09D 167/02 (2013.01); B32B 17/064 (2013.01); C03C 2218/365 (2013.01);
Abstract

The present invention provides a transparent substrate excellent in solvent crack resistance, toughness, heat resistance, and flexibility. A transparent substrate according to an embodiment of the present invention includes: an inorganic glass; and a first resin layer placed on at least one side of the inorganic glass, wherein: the first resin layer contains a resin compound having a weight-average molecular weight in terms of polystyrene of 8×10to 100×10; and no solvent crack occurs when a mixed solvent containing 20 wt % to 95 wt % of at least one kind of solvent selected from the group consisting of acetone, N-methylpyrrolidone, dimethyl sulfoxide, and N,N-dimethylformamide is brought into contact with the substrate.


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