The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2014

Filed:

Mar. 15, 2013
Applicant:

Koito Manufacturing Co., Ltd., Tokyo, JP;

Inventors:

Tetsuya Suzuki, Shizuoka, JP;

Akihiro Matsumoto, Shizuoka, JP;

Takashi Inoue, Shizuoka, JP;

Tomoyuki Nakagawa, Shizuoka, JP;

Naoki Sone, Shizuoka, JP;

Assignee:

Koito Manufacturing Co., Ltd., Minato-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2006.01); F21S 8/10 (2006.01); F21V 29/02 (2006.01); F21V 23/02 (2006.01); F21Y 101/02 (2006.01);
U.S. Cl.
CPC ...
F21V 29/22 (2013.01); F21V 29/02 (2013.01); F21S 48/1159 (2013.01); F21S 48/00 (2013.01); F21V 23/02 (2013.01); F21Y 2101/02 (2013.01); F21S 48/325 (2013.01); F21V 29/027 (2013.01); F21S 48/321 (2013.01); F21S 48/1109 (2013.01);
Abstract

A circuit module includes: a lighting control circuit that controls lighting of a semiconductor light emitting element; a first heat radiating member on which the lighting control circuit is mounted; a second heat radiating member that is separated from the first heat radiating member and has a surface on which the semiconductor light emitting element is mounted; and a connecting mechanism having both a housing that connects the first heat radiating member and the second heat radiating member together and a conductive portion that transmits a signal from the lighting control circuit to the semiconductor light emitting element. The housing is formed of a material having a coefficient of thermal conductivity lower than those of the first heat radiating member and the second heat radiating member.


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